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TU-747 HF

Mid. Tg Halogen Free Material
Core: TU-747 HF; Prepreg: TU-747P HF

TU-747 HF/TU-747P HF halogen free materials are formulated with epoxy resin, non-PN (free phenolic group containing) curing agent and impregnated onto standard E-glass fabric. Unlike conventional FR-4 materials where brominated resin is uses as flame retardant, TU-747 HF/TU-747P HF achieves the flammability class of UL94V-0 by incorporating nitrogen compounds into the resin formulation. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. The UV-block characteristic of the materials is compatible with the standard AOI process. TU-747P HF is uses with TU-747 HF for making multilayer printed wire boards. TU-747 HF is also available for single/double sided application. TU-747 HF laminates also exhibit superior chemical resistance, thermal stability and CAF resistance.

Main Applications
  • Servers, Telecom, Base station
  • Office Routers
  • Mobile Communication
Key Features
  • Halogen, antimony, PN(phenolic group) resin and red phosphorous free
  • Environmental friendly materials
  • Compatible to PCB processes
  • Low coefficient of thermal expansion
  • Lower Df, better stability of Dk/Df
Property Typical Values
Tg (TMA) 150°C
Td (TGA) 360°C
CTE z-axis (50 to 260 °C) 2.9%
T-288 >60 min
Permittivity (RC 75%) @1GHz 3.6
Loss Tangent (RC 75%) @1GHz 0.012

 

Industry Approvals
  • UL Designation - ANSI Grade: FR-4.1
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation : /127, /128
Standard Availability
  • Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 5oz
  • Prepregs: Available in roll or panel form