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TU-662F

Mid-Tg and High Thermal Reliability Laminate and Prepreg
Core: TU-662 F; Prepreg: TU-66P F

TU-662 F laminate / prepreg materials made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 F laminates exhibit excellent CTE, superior chemical resistance, and thermal stability for lead free soldering assembly with general CAF resistance.

Main Applications
  • Automotive
  • Consumer Electronics
Key Features
  • Lead Free process compatible
  • Excellent coefficient of thermal expansion ( CTE )
  • Anti-CAF property
  • Use friendly FR-4 processing conditions such as oxide, press, drilling and desmear
  • Superior chemical and thermal resistance
  • Fluorescence for AOI
  • Optical characteristics provide UV-block property
  • High interlayer bonding strength with optimum resin flow
  • Low moisture absorption
Property Typical Values
Tg (DMA) 165°C
Tg (DSC) 155°C
Tg (TMA) 145°C
Td (TGA) 345°C
CTE z-axis (50 to 260 °C) 2.8%
T-260/ T288 >60 min/ >20 min
Permittivity (RC 50%) @1GHz 4.7
Loss Tangent (RC 50%) @1GHz 0.018

 

Industry Approvals
  • IPC-4101 Type Designation : /21, /98, /99, /101
  • UL Designation - ANSI Grade: FR-4.0
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130 ℃
Standard Availability
  • Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 6 oz (HTE) for built-up; 1/3 to 3 oz (HTE) for double sides and H to 2 oz (MLS)
  • Prepregs: Available in roll or panel form
  • Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628 etc.
Property

PDF Downloads

Datasheet