這個頁面上的內容需要較新版本的 Adobe Flash Player。

取得 Adobe Flash Player

TU-863P MF

High Tg Low Loss Halogen Free Low flow Prepreg
Prepreg: TU-863P MF

TU-863P MF low loss, low flow halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding applications. The special design TU-863P MF low flow, low loss halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board applications. TU-863P MF low flow prepreg also provide excellent bonding performance with a variety of materials and with excellent high Tg, low CTE thermal performance for sequential lamination and lead-free processes.

Main Applications
  • High Speed Rigid-flex Board
  • Heat sink, Cavity
Key Features
  • Stable resin flow
  • Excellent bonding strength with polyimide materials
  • Low resin powder dust generation
  • High Tg, low loss and halogen free characteristics
  • Lead Free process compatible
  • Reduced z-axis thermal expansion
  • Superior dimensional stability, thickness uniformity and flatness
  • Good drilling & lamination processes friendly
  • Superior dielectric thickness control
Property Typical Values
Tg (DMA) 200°C
Tg (TMA) 165°C
Td (TGA) 375°C
CTE z-axis (50 to 260 °C) 2.5%
T-260/ T-288 >60 min/ >60 min
Permittivity (RC 50%) @1GHz 4.1
Loss Tangent (RC 50%) @1GHz 0.007

 

Industry Approvals
  • IPC-4101E Type Designation : /127, /128, /130
  • IPC-4101E/130 Validation Services QPL Certified
  • UL Designation - ANSI Grade: FR-4.1
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
Standard Availability
  • Prepregs: Available in roll or panel form
  • Glass Styles: 106 and 1080, other prepreg grades are available upon request
Property

PDF Downloads

Datasheet