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TU-787 LK

Halogen Free Laminate and Prepreg
Core: TU-787 LK ; Prepreg: TU-787P LK

TU-787 LK halogen free material is formulated with novel low Dk/Df epoxy resin, curing agent and impregnated onto standard E-glass fabric to achieve low loss category high performances material. TU-787 LK targets the material for advanced mobile devices application which features short signal rising time, ultra-thin dielectric thickness, excellent dimensional stability and high material modulus. TU-787P LK prepreg is designed for use with TU-787 LK laminate for making multilayer printed wire boards. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. TU-787 LK laminates also exhibit superior chemical resistance, thermal stability and CAF resistance.

Main Applications
  • Smart phone, Telecom
  • Office Routers
  • Mobile Communication
Key Features
  • Halogen, antimony and red phosphorous free
  • Halogen, antimony, PN (phenolic group) resin and red phosphorous free
  • Low and stable Dk/Df
  • Ultra thin core and prepreg design
  • Superior dimensional stability
  • Compatible to PCB processes
  • Low coefficient of thermal expansion
  • High modulus properties
Property Typical Values
Tg (TMA) 160°C
Td (TGA) 380°C
CTE z-axis (50 to 260 °C) 2.7%
T288 > 60 min
Dk/Df @ RC75 Dk@10GHz 3.4
Dk/Df @ RC75 Df@10GHz 0.0009

 

Industry Approvals
  • IPC-4101 Type Designation : /127, /128, /130
  • UL Designation - ANSI Grade: FR-4.1 ( under registration )
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
Standard Availability
  • Thickness: 0.001” [0.03mm] to 0.062” [1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 5 oz
  • Prepregs: Available in roll or panel form
  • Glass Styles: 1015, 1027, 1037, 1067, 1078, 3313, etc.
Property

PDF Downloads

Datasheet