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TU-872 SLK

Low Dk/Df and High Thermal Reliability Material
Core: TU-872 SLK; Prepreg: TU-87P SLK

TU-872 SLK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 SLK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.

Main Applications
  • Radio Frequency
  • Backpanel, High performance computing
  • Line cards, Storage
  • Servers, Telecom, Base station
  • Office Routers
Key Features
  • Excellent electrical properties
  • Dielectric constant less than 4.0
  • Dissipation factor less than 0.010
  • Stable and flat Dk/Df performance
  • Compatible with modified FR-4 processes
Property Typical Values
Tg (DMA) 220°C
Tg (DSC) 200°C
Tg (TMA) 190°C
Td (TGA) 340°C
CTE z-axis (50 to 260 °C) 2.3%
T-260/ T288 60 min/ 20 min
Permittivity (RC 50%) @10GHz 3.8
Loss Tangent (RC 50%) @10GHz 0.009

 

Industry Approvals
  • UL Designation - ANSI Grade: FR-4.0
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation : /29, /98, /99, /101, /126
  • IPC-4101E/126 Validation Services QPL Certified
Standard Availability
  • Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 5oz for built-up & double sides
  • Prepregs: Available in roll or panel form