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TU-862S

Hi-Tg Halogen Free Mid-Loss Material
Core: TU-862S; Prepreg: TU-862P S

TU-862S Hi-Tg halogen free Mid-loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with lower dielectric constant and dissipation factor for high speed mid-loss multilayer circuit server board application. Unlike conventional FR-4.0 material using brominated resin as flame retardant. TU-862S achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. TU-862S material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, mid-loss signal attenuation and eliminate the use of potential hazardous halogenated resins.

Main Applications
  • Backpanel, High performance computing
  • Line cards, Storage
  • Servers, Telecom, Base station
  • Office Routers
Key Features
  • Lower Dk & Df performance, mid-loss applications
  • Lead free process compatible
  • Environmental friendly materials
  • Compatible to PCB processes
  • Low coefficient of thermal expansion
  • Moisture resistance
  • Anti-CAF capability
Property Typical Values
TG(DMA) 200℃
TG(TMA) 165℃
Td  (TGA) 370℃
CTE z-axis (50 to 260 °C) 2.2%
T-260 / T288 > 60 min/> 60min
Permittivity(RC 50%)@ 1GHz 4.3
Loss Tangent(RC 50%)@ 1GHz 0.011

 

Industry Approvals
  • UL Designation - ANSI Grade FR-4.1
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation: /127, /128, /130
  • IPC-4101E/130 Validation Services QPL Certified
Standard Availability
  • Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 4 oz for built-up & double sides
  • Prepregs: Available in roll or panel form
Property

PDF Downloads

Datasheet