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ThunderClad 3

Super Low Loss and High Thermal Reliability Laminate and Prepreg
Core: TU-933; Prepreg: TU-933P

ThunderClad 3 is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss filed applications. ThunderClad 3’s electrical performance is competitive with PTFE-based, hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability.
ThunderClad 3 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and also compatible with modified FR-4 processes.

Main Applications
  • Radio frequency
  • Backplane, High performance computing
  • Line cards, Storage
  • Servers, Telecom, Base station
  • Office Routers
Key Features
  • Excellent electrical and thermal properties
  • Dielectric constant is 3.4 @ 10Gz
  • Dissipation factor is 0.0025 @ 10Ghz
  • Stable and flat Dk/ Df performance over frequency and temperature variance
  • Excellent moisture resistance and Lead Free reflow process compatible
  • Excellent through-hole and soldering reliability
Property Typical Values
Tg (DMA) 220°C
Tg (TMA) 170°C
Td (TGA) 390°C
CTE z-axis (50 to 260 °C) 2.7%
T-260/ T288/ T300 > 60 min/ > 60 min/ > 60 min
Permittivity (RC 50%) @10GHz 3.4
Loss Tangent (RC 50%) @10GHz 0.0025

 

Industry Approvals
  • UL File Number: E189572
  • ANSI Grade: No-ANSI
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Specification Number: /102
  • IPC-4101 Specification Number: /102
  • IPC-4101E/102 Validation Services QPL Certified
Standard Availability
  • Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
  • Prepregs: Available in roll or panel form
Property

PDF Downloads

Datasheet