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TU-872 SLK Sp

Low Dk/Df and High Thermal Reliability Material
Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

Main Applications
  • Radio Frequency
  • Backpanel, High performance computing
  • Line cards, Storage
  • Servers, Telecom, Base station
  • Office Routers
Key Features
  • Excellent electrical properties
  • Dielectric constant less than 3.5
  • Dissipation factor less than 0.010
  • Excellent, stable and flat Dk/Df performance
  • Compatible with modified FR-4 processes
Property Typical Values
Tg (DMA) 220°C
Tg (DSC) 200°C
Tg (TMA) 190°C
Td (TGA) 340°C
CTE z-axis (50 to 260 °C) 2.3%
T-260/ T288 60 min/ 20 min
Permittivity (RC 50%) @10GHz 3.5
Loss Tangent (RC 50%) @10GHz 0.008
Industry Approvals
  • UL Designation - ANSI Grade: FR-4.0
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation : /29, /98, /99, /101, /126
  • IPC-4101E/126 Validation Services QPL Certified
Standard Availability
  • Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 5oz for built-up & double sides
  • Prepregs: Available in roll or panel form