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TU-622-5

Mid Tg Std. Epoxy multilayer Material
Core: TU-622-5; Prepreg: TU-62P-5

TU-622-5/ TU-62P-5 laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. TU-62P-5 is designed for use with TU-622-5 following standard processing conditions to make FR-4 thin-core multilayer printed circuit boards.

Main Applications
  • Consumer Electronics
Key Features
  • Cost effective way to meet the higher Tg requirement
  • Use friendly FR-4 processing conditions such as oxide, press, drilling and desmear
  • Chemical and thermalresistance property
  • Superior dimensional stability, thickness uniformity and flatness
  • Fluorescence for AOI
Property Typical Values
Tg (DMA) 155°C
Tg (DSC) 145°C
Tg (TMA) 135°C
Td (TGA) 310°C
CTE z-axis (50 to 260 °C) 4.1%
T-260 >60 min
Permittivity (RC 50%) @1GHz 4.2
Loss Tangent (RC 50%) @1GHz 0.015

 

Industry Approvals
  • UL Designation - ANSI Grade: FR-4.0
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation : /21
Standard Availability
  • Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 5oz (HTE) for built-up; 1/3 to 12oz (HTE) for double sides and H to 2oz (MLS)
  • Prepregs: Available in roll or panel form