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TU-662

Mid Tg High Thermal Reliability Material
Core: TU-662; Prepreg: TU-66P

TU-662/ TU-66P.laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 laminates exhibit excellent CTE, superior chemical resistance, and thermal stability for lead free soldering assembly with general CAF resistance.

Main Applications
  • Consumer Electronics
  • Automotive
Key Features
  • Lead free processing compatible
  • Excellent coefficient of thermal expansion
  • Anti-CAF property
  • Use friendly FR-4 processing conditions such as oxide, press, drilling and desmear
  • Superior chemical and thermal resistance
Property Typical Values
Tg (DMA) 160°C
Tg (DSC) 150°C
Tg (TMA) 140°C
Td (TGA) 340°C
CTE z-axis (50 to 260 °C) 3.2%
T-260/ T288 >60 min/ >10 min
Permittivity (RC 50%) @1GHz 4.3
Loss Tangent (RC 50%) @1GHz 0.014
Industry Approvals
  • UL Designation - ANSI Grade: FR-4.0
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation : /21, /98, /99, /101
Standard Availability
  • Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 6oz (HTE) for built-up; 1/3 to 3oz (HTE) for double sides and H to 2oz (MLS)
  • Prepregs: Available in roll or panel form