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TU-722

High-Tg Thermal Resistance Laminate and Prepreg
Core: TU-722; Prepreg: TU-72P

TU-722/TU-72P laminate/ prepreg offer enhanced thermal resistance and also provide UV-block characteristic and compatibility with AOI process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. The lower Z-axis thermal expansion also minimizes the problems, such as lifted pads and barrel cracks. TU-722 laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and with general CAF resistance property.

Main Applications
  • Office Routers
  • Server, workstation
Key Features
  • Lead free process compatible
  • Anti-CAF capability
  • Superior dimensional stability, thickness uniformity and flatness
  • Good drilling processability
  • Excellent through-hole and soldering reliability
  • High interlayer bonding strength with optimum resin flow
  • Superior dielectric thickness control
  • Wide processing window for maximum lamination performance
  • Excellent thermal and chemical resistance
  • Compatible with AOI process with UV-block property
  • Higher Tg characteristics
  • Reduced Z-axis thermal expansion
Property Typical Values
Tg (DMA) 185°C
Tg (DSC) 175°C
Tg (TMA) 165°C
Td (TGA) 330°C
CTE z-axis (50 to 260 °C) 3.5%
T-260/ T288 >30 min/ >5 min
Permittivity (RC 50%) @1GHz 4.2
Loss Tangent (RC 50%) @1GHz 0.016

 

Industry Approvals
  • IPC-4101 Type Designation : /21, /24, /26, /28, /121, /124
  • UL Designation - ANSI Grade: FR-4.0
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
Standard Availability
  • Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/3 to 5oz (HTE) for built-up; 1/8 to 12oz (HTE) for double sides and H to 2oz (MLS)
  • Prepregs: Available in roll or panel form
  • Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628, etc.