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TU-768

High Tg High Thermal Reliability Material
Core: TU-768; Prepreg: TU-768P

TU-768/ TU-768P laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications
  • Line cards, Storage
  • Servers, Telecom, Base station
  • Office Routers
  • Automotive
Key Features
  • Lead free processing compatible
  • Excellent coefficient of thermal expansion
  • Anti-CAF property
  • Superior chemical and thermal resistance
  • Fluorescence for AOI
Property Typical Values
Tg (DMA) 190°C
Tg (DSC) 180°C
Tg (TMA) 170°C
Td (TGA) 350°C
CTE z-axis (50 to 260 °C) 2.7%
T-260/ T288 >60 min/ >15 min
Permittivity @1GHz (RC 50%) 4.3
Loss Tangent @1GHz (RC 50%) 0.018

 

Industry Approvals
  • UL Designation - ANSI Grade: FR-4.0
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation : /21, /24, /26, /28, /98, /99, /101, /126
Standard Availability
  • Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form
  • Copper Foil Cladding: 1/8 to 12oz (HTE) for built-up; 1/8 to 3oz (HTE) for double sides and H to 2oz (MLS)
  • Prepregs: Available in roll or panel form