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TU-84P NF

High Tg Halogen Free No-flow Prepreg
Prepreg: TU-84P NF

TU-84P NF no-flow, halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding application. The special design TU-84P NF no-flow, halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board application. TU-84P NF no-flow prepreg also provide excellent bonding performance with a variety of polyimide materials and with excellent high Tg, low CTE thermal performance for sequential lamination and lead-free processes.

Main Applications
  • Rigid-flex 
  • Heat sink, Cavity
Key Features
  • Stable resin flow
  • Excellent bonding strength with polyimide materials
  • Low resin powder dust generation
  • Higher Tg and halogen free characteristics
  • Lead free process compatible
Property Typical Values
Tg (DMA) 190°C
Tg (TMA) 165°C
Td (TGA) 390°C
CTE z-axis (50 to 260 °C) 2.1%
T-260/ T-288 >60 min/ >60 min
Permittivity (RC 50%) @1GHz 4.4
Loss Tangent (RC 50%) @1GHz 0.010

 

Industry Approvals
  • UL Designation - ANSI Grade: FR-4.1
  • UL File Number: E189572
  • Flammability Rating: 94V-0
  • Maximum Operating Temperature: 130°C
  • IPC-4101 Type Designation : /127, /128, /130
  • IPC-4101E/130 Validation Services QPL Certified
Standard Availability
  • Thickness: 0.002” [0.05mm] (106 type x 1 ply) to 0.003” [0.08mm] (1080 type x 1 ply)
  • Prepregs: Available in roll or panel form