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多層壓合代工服務

Highlights UL Certification
Mass Lamination Service

TUC uses cutting edge equipment to provide mass lamination service to global PCB manufacturers – from image transfer to automatic build-up to optical inspection.  Focusing on applications with impedance control, HDI-designs and high layer counts, TUC offers customers not only a total solution with CCL expertise and PCB inner layer processes, but also production flexibility and cost savings.  Between TUC’s Taiwan and Changshu plants, total manufacturing capacity exceeds 2,400,000 square feet per month.

Process Capability
  • Min line width/space: 3/3 mils over H oz
  • Layer registration: 4 mils
  • Tooling hole distance: ± 2 mils
  • Min NC drilling size: 8 mils
  • NC drilling registration: 3 mils
  • Max working size: 24 x 28 inches
  • Min thickness: 10 mils (4L), 16 mils (6L), 22mils (8L), 28 mils (10L), 34 mils (12L)
  • Max thickness: 200 mils
  • Max layer count: 22 layers
Applications
  • ≥18 layers PCB for servers, backpanels and base stations.
  • 10~16 layers PCB for backpanels, base stations, switches, routers and servers.
  • 6~8 layers PCB for DDR modules, HDD, LCD and graphics cards.
  • 4 layers PCB for automotive, LCD applications, HDI designs and motherboards.