TUC delivers speed, reliability and value
with TU-872 LK/ SLK

The toughness enhanced by an allyl network forming compound in a patent pending technology.

- Dk 3.8; Df 0.009 @10GHz
- High Tg 200 °C/DSC; High Td 340°C/TGA and Survives 10X IR-reflow @260 °C
- Improved z-axis thermal expansion less than 2.5%

 

Halogen Free Materials

- Environmental friendly materials for lead-free processing compatible
- High thermal reliability and low z-axis thermal expansion
- For mobile communications,servers, base stations and office routers applications
- No-flow and mid-flow Prepreg for rigid-flex and IC Substrate (Cavities) applications

 

High Thermal Reliability Laminates

- Lead free processing compatible
- Excellent coefficient of thermal expansion
- For servers,base stations, Automotive and consumer
   electronics applications

TUC Products:

2017-01-16

敬邀参观 台燿科技摊位No. 3917

IPC APEX EXPO 2017
Booth No.: 3917
Date: February 14-17

台燿科技于1997年起成功转型跨足铜箔基板(Copper Clad Laminate)与黏合片(Prepreg)之生产制造,持续提供全球电子产业所需的一流品质、服务及高附加价值的基础材料与多层压合...

为了坚守品质稳定而可靠的产品,台燿科技坚持选用优良的原物料及制订严谨的制造管理,并积极研发各项因应全球电子产业应用于手机板、基地台背板、通讯板、伺服器、汽车板等领域,具备…

为了提供整体及快捷有效之解决方案予遍及全球的客户,台燿科技团队集合印刷电路板及铜箔基板相关领域之资深经历的专业人员,分别于台湾、中国、日本、南韩、台湾、美国及德国布有服务据点...

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